STAYCLNALUMFLX4OZ(ORM-D)NO AIR!
STAY CLEAN GENERAL PURPOSE LIQUID FLUX
STAYCLNALUMFLX4OZ(ORM-D)NO AIR!
STAYCLNALUMFLX4OZ(ORM-D)NO AIR!
STAYCLNALUMFLX4OZ(ORM-D)NO AIR!

Stay-Clean® Aluminum Soldering Flux

SCAF4

Stay-Clean® aluminum soldering flux 24 ea. 4 oz. jar w/brush cap

DETAILS

Stay-Clean® is an active flux formulation designed for soldering aluminum and joining aluminum to other metals. The flux is formulated with amines and complex inorganic fluorides and was designed for use with Harris’ Alsolder® 500. It is also a good choice for use with other tin based solders that have a suitable melting temperature. During the initial heating process, it is important to avoid directing the flame on the flux. Heat should be directed adjacent to the flux while allowing the heat to be conducted through the base metal. The fluxing action decreases near 600◦F (315◦C), so avoid overheating. The flux is slightly corrosive, so post soldering residue should be removed with hot water or other suitable cleaner. Complies with the EU Reach & RoHS directive.

Features

  • Flux for use with aluminum soldering
  • Use with Al-Solder 500
  • Works to join aluminum-to-aluminum and aluminum-to-dissimilar metals
  • Typically used for soldering aluminum and joining aluminum to other metals

Disclaimers

Warning -

Cancer and Reproductive Harm -

www.P65Warnings.ca.gov

Warranty Information

  • 1 Year

What's Included

  • Stay-Clean® aluminum soldering flux 24 ea. 4 oz. jar w/brush cap

Specifications

Consumables

Alloy Type Flux
Chemical Composition Proprietary
Classification Manufactured to Harris Products Group's internal engineering standards
Color Brown
NSF Compliant No
Ph 7 - 9
RoHS Compliant Yes
Size 4 oz. jar w/brush cap
Soldering Temperature Range 350° F - 550° F (177° C - 288° C)
Specific Gravity 1.30 @ 68°F
Typical Application Soldering aluminum and joining aluminum to other metals
Used with other tin based solders with a suitable melting temperature

Warranty

Warranty 1 Year